Cyclone V E Video Development System

Cyclone V E Video Development System

Altera Cyclone V E Video Development System

Featured devices:

  • Cyclone V E FPGA - 5CEFA7F31I7N
  • MAX V CPLD - 5M2210ZF256I5N (system controller)
  • MAX II CPLD - EPM240M100I5N (embedded USB Blaster II) 

 

Configuration:

  • On-board USB-BlasterTM II cable (USB, PHY, Max® V CPLD)
  • JTAG direct via JTAG header

 

Memory devices

  • DDR3 x32 at 300 MHz (soft memory controller)
  • LPDDR2 x16 (soft memory controller)
  • Flash (512 Mb)
  • SSRAM (18 Mb)
  • EEPROM (64 Kb)

 

General user input/output

  • User control
  • Four pushbuttons
  • Five LEDs
  • Four DIP switches
  • 2x Resets (CPU reset, Dev Clear)
  • LCD: Character LCD (16x2)

 

Components and interfaces

  • RJ45 for Ethernet
  • UART interface

 

Quartus® II design software information

  • Quartus II Web Edition Software

 

Altera Cyclone V E FPGA Development Board Block Diagram

Terasic DVI-HSMC Card

Digital Transmitter

  • One DVI transmitter with single transmitting port
  • Digital Visual Interface (DVI) Compliant
  • Supports resolutions from VGA to UXGA (25 MHz – 165 MHz Pixel Rates)
  • Universal Graphics Controller Interface
    • 12-Bit, Dual-Edge and 24-Bit, Single-Edge Input Modes
    • Adjustable 1.1 V to 1.8 V and Standard 3.3 V CMOS Input Signal Levels
    • Fully Differential and Single-Ended Input Clocking Modes
    • Standard Intel 12-Bit Digital Video Port Compatible as on Intel™ 81x Chipsets
  • Enhanced PLL Noise Immunity
    • On-Chip Regulators and Bypass Capacitors for Reducing System Costs
  • Enhanced Jitter Performance
    • No HSYNC Jitter Anomaly
    • Negligible Data-Dependent Jitter
      • Programmable Using I²C Serial Interface
      • Single 3.3-V Supply Operation

 

Digital Receiver

  • One DVI receiver with single receiving port
  • Supports UXGA Resolution (Output Pixel Rates Up to 165 MHz)
  • Digital Visual Interface (DVI) Specification Compliant
  • True-Color, 24 Bit/Pixel, 16.7M Colors at 1 or 2-Pixels Per Clock
  • Laser Trimmed Internal termination Resistors for Optimum Fixed Impedance Matching
  • 4x Over-Sampling
  • Reduced Ground Bounce Using Time Staggered Pixel Outputs
  • Lowest Noise and Best Power Dissipation Using TI PowerPAD™ Packaging

 

Overview
Layout